The monitoring hardware in SoCs, incorporated by UltraSoc, are complex to enable analytics capabilities directly from the factory to field application and optimize product performance to ensure devices are operating as designed in terms of functional safety and cybersecurity
Siemens has signed an agreement to acquire UltraSoC Technologies Ltd., based in Cambridge, UK, a provider of instrumentation and analysis solutions that incorporate intelligent monitoring, cybersecurity and functional security capabilities into the SoC's (system-on-a-chip) core hardware. ). Siemens plans to integrate UltraSoC technology into its Xcelerator portfolio as part of Mentor's Tessent™ software products.
Incorporating UltraSoC into Siemens enables a unified data-based infrastructure that can improve product quality, security and cybersecurity, and create a comprehensive solution to help semiconductor industry customers solve challenges such as manufacturing defects, manufacturing bugs. software and hardware, premature device failure and wear, functional security and malicious attacks.
"With the acquisition of UltraSoC by Siemens, for the first time, our customers will have access not only to design for testing, but also to a comprehensive design solution for managing the product lifecycle of chip systems, including functional safety, security and optimization," says Brady Benware, vice president of Tessent and general manager of Siemens Digital Industries Software. "UltraSoC has a fast-growing business and an impressive list of customers and, as part of Siemens, can complement Tessent's products and create unique solutions in the market," he adds.
UltraSoC has pioneered the incorporation of monitoring hardware into complex SoCs to enable analytics capabilities straight from the factory to field application, designed to accelerate the use of silicon chips, optimize product performance and ensure devices are operating as designed in terms of functional security and cybersecurity. Tessent is a market reference in design solutions for SoC testing, having established its strength in the field of automotive functional safety through its Tessent security ecosystem. These two complementary offerings form the basis of a complete package of solutions, covering semiconductor design and production, functional safety, cybersecurity and functional optimization of products in the field.
The combination of Siemens and UltraSoC technologies can benefit the entire semiconductor lifecycle, including the structural, electrical and functional capabilities of the SoCs, as well as use in Siemens comprehensive digital twin with UltraSoC, providing real device monitoring.
"Being part of one of the world's leading technology companies will allow UltraSoC to better serve customers, accelerating research and development and using a much larger set of resources to launch the product to market and a large global infrastructure. It has been clear since. our kickoff meeting that UltraSoC and Siemens share a vision of how the technology businesses can transform their end-to-end operations, from project design to field implementation, so we can't wait to join the group," said Rupert Baines, CEO of UltraSoC.
Rupert Baines, CEO of UltraSoc
UltraSoC products are widely used in the automotive, high-performance computing, storage and semiconductor industries. The company was recently selected to participate in the program DARPA ISS (Automatic Implementation of Secure Silicon, or automatic implementation of secure silicon); in addition to being a member of the Secure-CAV consortium, an ambitious collaborative project aimed at improving the security of the connected and autonomous vehicles (CAVs) of the future. Siemens' acquisition of UltraSoC is expected to close in the fourth quarter of Siemens' fiscal year 2020. The terms of the transaction were not disclosed.
To learn more about Siemens SoC solutions, visit www.siemens.com/mentor.
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